Abstract
High-precision optical component manufacturing by ion beam machining tools with ultra-high material removal resolution and dynamically adjustable removal efficiency is important in various industries. In this paper, we propose a low-energy pulsed ion beam (LPIB) technology that can obtain a single pulse with high-resolution material removal by adjusting the pulse frequency and duty cycle, and enable the dynamic adjustment of the removal efficiency. The pulse frequency is 1–100 Hz, and the duty cycle is 0–100%. For monocrystalline silicon, the pulse frequency and duty cycle are set to 100 Hz and 1%, respectively; thus, the single-shot pulse depth removal resolution of material is 6.7 × 10−4 nm, which means every 21 pulses can remove one silicon atom layer. Compared with IBF, where the removal resolution of the maximum depth is about 0.01 nm, the controllable resolution is one to two orders of magnitude higher. There is a linear relationship between the removal efficiency of the pulsed ion beam removal function and the pulse duty ratio. The material removal of a single pulse can be adjusted in real time by adjusting the pulse duty cycle and frequency. Owing to its high resolution and wide adjustable removal efficiency, LPIB has broad application prospects in the field of sub-nano-precision surface modification, quality tuning of inertial resonant devices, and so on. This technology is expected to advance surface processing and ultra-precision manufacturing.
Highlights
[24], the experiment removal fluctuation of the ion source is generally within 5% [24], the experiment results results show that the fluctuation of each parameter was within this range, which indicates that the show that the fluctuation of each parameter was within this range, which indicates that time stability of the low-energy pulsed ion beam (LPIB) is similar to that of the normal ion beam
Considering that the removal fluctuation of the ion source is generally within 5% [24], the experiment results show that the fluctuation of each parameter was within this range, which indicates that the time stability of the LPIB is similar to that of the normal ion beam
As LPIB is limited to the resolution of the measuring equipment, we adopted the method of analogical reasoning when obtaining ultra-high material removal resolution, which failed to directly measure the material removed by a single pulse
Summary
A removal function with higher resolution cannot be used in actual processing processes due to its extremely low removal efficiency It does not seem as if there is a direct removal and non-contact surface material treatment method that can simultaneously achieve micro ultra-high controllable removal resolution and adjustable removal efficiency [20]. LPIB is a material processing technology with ultra-high removal resolution and wide adjustable removal efficiency. It has various applications in the fields of inertial resonance device quality modification, sub-nanometer precision surface modification, micro-nano electromechanical systems, special surface preparation, and so on. It will promote the progress of material processing technology and ultra-precision manufacturing technology
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