Localized Electrochemical Deposition Using Ultra-High Frequency Pulsed Power

Abstract

In this experimental study, localized electrodeposition of nickel pillars was performed to study the effect of pulse frequency, applied voltage, pulsed duty cycle, and the interelectrode gap, on the diameter of the deposit and the rate of deposition height. The effects of ultra-high frequency during the localized electrodeposition process, which have not been studied for micro electrochemical additive manufacturing purposes, are documented and further quantification of the effects of localization was conducted. It was found that the rate of deposition height increased with an increase in the pulse frequency, applied voltage, and duty cycle. As for deposition diameters, which is a measure of the localization, inter electrode gap was found to have no significant effect, while with pulse voltage and frequency, the average deposition diameter for certain parameters was substantially smaller than the tool electrode diameter, by approximate ratios of 2/3 and 1/5 respectively. These findings imply that modifying the electrical process parameters can allow for highly localized electrochemical deposition which is an important requirement for electrochemical additive manufacturing.