Low dielectric styrene-based resins with enhanced mechanical properties via introducing coordination bonds

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A big challenge for current low dielectric permittivity (low-k) materials is to enhance their mechanical strength while preserving low-k properties. In this work, we propose a new method via introducing coordination bonds to enhance the mechanical strength of styrene-based resins while preserving their low-k properties. When incorporating 2 mol.% coordination bonds in cross-linked network of resins, the tensile strength of styrene resin was found to increase from 30 to 50 MPa, while the module was increased from 400 to 700 MPa. This increase may be resulted from the in situ formation of nanocomposites via coordination reaction accompanied with polymerization and cross-linking.