Low-density polycarbonate composites with robust hollow glass microspheres by tailorable processing variables

Abstract

Polycarbonate (PC) composites with low weight have been required for mobile applications. Herein, the incorporation of 15 phr (parts per hundred of resin) soda-lime borosilicate hollow glass microspheres (HGMs) into a PC matrix reduced the specific gravity by 15.2%. The microsphere preservation rate was systematically examined depending on HGM compressive strength, and processing conditions for extrusion (side-feeding vs. main-feeding vs. screw configuration) and injection molding (mild condition for edge gate vs. extreme condition for pinpoint gate). Various transition temperatures such as glass transition temperatures and heat distortion temperature were investigated as a function of HGM. The coefficient of thermal expansion of the 15 phr HGM-embedded PC composites was reduced by 51.9%. The rheological behavior of the composites was also probed. The toughness was reduced due to the ductile-to-brittle transition of PC caused by the incorporation of fillers despite the enhanced modulus. The incorporation of the robust hollow glass microspheres into a PC composite via a delicately designed screw configuration and suitable processing conditions can be used for low-density composites such as mobile applications.