Abstract
A family of X-band MMIC power amplifiers using a low cost GaAs pHEMT process is reported. The stepper-based volume 0.5 micron and 0.25 micron GaAs pHEMT processes utilize 4 inter-level metallisation and four dielectric layers for high frequency performance whilst maintaining the economies of scale of 150mm (6) diameter substrates. The fabricated GaAs X-Band PA MMICs exhibit SW to low NY output power under pulsed conditions; 16dB of power gain and power added efficiencies approaching 40%. Excellent repeatability and high yields over a number of wafers have been demonstrated. The design and GaAs process approach taken here with DUV stepper and 150 mm wafer diameter will lead to a significant cost reduction for high performance power amplifier MMICs up to 30GHz.
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