Low-cost packaging of semiconductor laser arrays

Abstract

This article reports on a passive self-alignment technique that we developed for semiconductor waveguide array packaging. A flip-chip Si-motherboard technique is described for the packaging of 4-, 8-, and 12-channel 980 nm laser arrays with fiber ribbons. A major aspect of this development is also to show that minor modifications on an existing laser fabrication process, carried out at the IBM Zurich Research Laboratory, and a specially developed motherboard from our lab, allow a passive self-aligned packaging process.