Abstract
A new type of integrated sensor structure has been developed for transcutaneous blood oxygen monitoring. It is based on multilayer ceramic technology which is used in the fabrication of high density electronic interconnection systems. The electrodes are made by thick film technology using precious metal pastes. The heating element is an integrated thick film resistor and a pn junction is used as temperature sensor chip. The sensor structure is based on microelectronic technologies and can be produced at low costs. The technology, parameters and results from the praxis will be demonstrated in the paper.
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