Abstract
As a result of the dominance of urea formaldehyde (UF)-bonded particleboard, it seemed worthwhile to examine formaldehyde emissions years after production. A California Air Resources Board (CARB) phase II-compliant commercial particleboard produced with a UF resin adhesive was compared to a no-added formaldehyde (NAF)-particleboard produced with Soyad™ adhesive resin for formaldehyde emissions during exposure to elevated humidity and temperature conditions after being in a room at 21 ± 1.9 °C, 50 ± 3.3% relative humidity for 3.5 years. A modified version of EN 717-3 was used to collect formaldehyde emissions under typical along with higher temperature and humidity conditions. The formaldehyde emissions from the commercial particleboard panel bonded with a UF adhesive even after the 3.5 years of exposure greatly increased only during exposure of the panels to elevated heat and humidity compared to typical testing conditions. The amounts were the same as those with the previous shorter-term study. In contrast, formaldehyde emissions from the NAF-bonded particleboard were not as susceptible (in absolute terms) to increases in temperature and relative humidity conditions.
Highlights
Due to adhesive costs, manufacturing robustness, and generally good bond performance, urea-formaldehyde (UF) resins are the dominant adhesive for manufacturing interior wood products, such as interior plywood, particleboard, and fiberboard [1]
To study the basic science of formaldehyde emissions from different particleboards, a static formaldehyde emissions method was employed to assess the changes in emissions for composite
The modifications allowed the test to be run under different temperature and relative humidity conditions to better understand the formaldehyde emissions of composite panels under other conditions than the “typical” conditions as mandated by the current testing method E1333
Summary
Due to adhesive costs, manufacturing robustness, and generally good bond performance, urea-formaldehyde (UF) resins are the dominant adhesive for manufacturing interior wood products, such as interior plywood, particleboard, and fiberboard [1]. A UF adhesive has a significant likelihood of depolymerization and emission of formaldehyde unlike the other formaldehyde-containing wood adhesives. Further studies demonstrated that as the heat and humidity increased, the formaldehyde release increased, as would be expected by the reversible reaction chemistry subject to polymer bond breakage via hydrolysis [4,5]
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