Local Rate of Electroless Copper Deposition By Scanning Tunneling Microscopy

Abstract

In electroless copper deposition with formaldehyde the anodic and cathodic partial reactions are strongly coupled. This nonlinear behavior may lead to local fluctuations of the deposition rate. We use in-situ scanning tunneling microscopy for the determination of local deposition rates. From the images and from single scan lines it can be seen that the deposition rate fluctuates locally and with time. These fluctuations do only occur during electroless deposition, in contrast to galvanic deposition, where all crystallites grow with the same, constant rate.KeywordsDeposition RateSurface Enhance Raman SpectroscopyCopper DepositionElectroless PlatingElectroless DepositionThese keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.