Abstract
Dimensional restrictions in electronic equipment have resulted in miniaturization of many existing cooling technologies. In addition to this, cooling solutions are required to dissipate increased thermal loads to maintain component reliability. Axial fans are widely used in electronics cooling to meet such thermal demands. However, if the extent of non-uniform heat transfer rates, produced by highly three-dimensional air patterns is unknown in the design stages, premature component failure may result. The current study highlights these non-uniformities in heat transfer coefficient, using infrared thermography of a miniature axial fan impinging air on a flat plate. Fan rotational speed and distance from the flat plate are varied to encompass heat transfer phenomena resultant from complex exit air flow distribution. Local peaks in heat transfer coefficient have been shown to be directly related to the air flow and fan motor support interaction. Optimum locations for discrete heat source positioning have been identified which are a function of fan to plate spacing and independent of fan rotational speed when the Reynolds number effect is not apparent.
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