Abstract
Abstract: Molecular dynamics (MD) is now playing a unique as well as conspicuous role in probing in nano‐science and technology. In this paper, MD simulation of uniaxial tension of some face‐centred cubic (FCC) metals (namely, Ag, Ni, Al and Cu) at nano‐scale was carried out. The effects of different loading rates on the stress–strain curves at a constant temperature of 300 K were studied. The potential used in these simulations was Sutton–Chen, and Velocity Verlet formulation of Noise‐Hoover dynamic was also applied to have a constant temperature ensemble. The boundary condition was periodic. Eventually, MD simulations were carried out and it was concluded that by increasing the loading rate both maximum stress and strain at failure increase. The maximum engineering stress for Al, Ag, Cu and Ni can be rounded as 4, 9, 12 and 18 GPa, respectively, for all loading rates.
Published Version
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