Abstract
LiTa03 single crystals were lapped and basic data were obtained relating to practical machining for opto-electronic elements and crystal filters. Moreover, the skin structure of the lapped surfaces and the chip-built-mechanism in lapping were considerd, based upon the examination by using oblique sectioning, electron diffraction etc. Stock removal rate, surface roughness, depth of damaged layer and depth of breakage at the periphery on the X-face of crystal are 1. 68 μm·m-1/kg·cm-2, 1. 3 μmRmax, 12 μm and 50 μm, respectively, in using # 1000 green silicon carbide abrasives and cast iron lap. These amounts are found to have a tendency to change in proportion to the average size of abrasives. Fracture inside the lapped surface advances along the cleavage surfaces and minute chips release easily from the bulk with cleavage.
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