Abstract
We have developed a package for disposable glucose sensor chips using Parylene encapsulation of a glucose oxidase solution in the liquid phase and a cover structure made of an ultraviolet (UV) curable adhesive. Parylene was directly deposited onto a small volume (1 μL) of glucose oxidase solution through chemical vapor deposition. The cover and reaction chamber were constructed on Parylene film using a UV-curable adhesive and photolithography. The package was processed at room temperature to avoid denaturation of the glucose oxidase. The glucose oxidase solution was encapsulated and unsealed. Glucose sensing was demonstrated using standard amperometric detection at glucose concentrations between 0.1 and 100 mM, which covers the glucose concentration range of diabetic patients. Our proposed Parylene encapsulation and UV-adhesive cover form a liquid phase glucose-oxidase package that has the advantages of room temperature processing and direct liquid encapsulation of a small volume solution without use of conventional solidifying chemicals.
Highlights
The number of diabetic patients has recently been increasing, reaching up to 180 million people world-wide according to a WHO report, so there has been high demand for blood glucose measurement methods for use in the diagnosis of diabetes [1]
Prodding of the Parylene film with a pen did not result in penetration of the film, which indicates that the glucose oxidase solution was fully encapsulated by the Parylene film
A low-temperature packaging process to seal glucose oxidase solution in the liquid phase without denaturation was developed using a package of Parylene-encapsulated glucose oxidase solution and a UV-adhesive cover
Summary
The number of diabetic patients has recently been increasing, reaching up to 180 million people world-wide according to a WHO report, so there has been high demand for blood glucose measurement methods for use in the diagnosis of diabetes [1]. Existing micro-packaging techniques used to package small volumes of glucose oxidase solution include plastic sealing, anodic bonding, and ultrasonic bonding [15,16]. Most of these methods use high temperatures (>150 °C) to melt and modify the surface of plastic, glass and silicon substrates for bonding. The bonding temperature was lower than that of the other bonding process, 180 °C was required for Parylene-Parylene adhesion, and the solvent for the glucose oxidase solution (i.e., water) evaporated upon sealing. We have developed a packaging process that involves Parylene encapsulation of glucose oxidase solution and use of a UV-adhesive cover to enable low temperature packaging (Figure 1). Glucose sensing by the packaged glucose oxidase solution was assessed to demonstrate the applicability of the package for glucose sensors
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