Abstract
A study is made for interfacial delaminations between dissimilar materials in LSI plastic packages caused by temperature cyclic loading. Combining a thermoelastic finite element method for nonlinear contact problems and linear fracture mechanics approach, stress intensity factors at the tips of growing delaminations are obtained for the packages with Cu alloy or 42 alloy (Fe-42%Ni) leadframe. The tendency of delamination growth are compared for the two configurations of delamination ; one along the interfaces between the top surface of the die pad and die-bonding layer and the other along those between the bottom surface of the die-pad and encapsulant resin. It is concluded that the former case is more likely to occur for the package with Cu alloy leadframe while for packages with 42 alloy leadframe, the latter case is more likely to occur.
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