Abstract
High thermally conductive materials with good electrical insulating and mechanical properties are indispensable for electronics. Aiming for all-polymer composites with light weight, electrical insulation and high thermal conductivity (TC), ultrahigh molecular weight polyethylene (UHMWPE) fibers/epoxy composites with two kinds of fiber orientation structures (0°/90°, ±45°) were fabricated by hot-pressing. It is found that the in-plane TC of ±45° composite is approximately 1.3–1.4 times that of 0/90° one, and the corresponding mechanism is verified by finite element simulation and model calculation. Thermally conductive pathways formed by UHMWPE fibers endow 0/90° and ±45° composites with the in-plane TC of 9.94 and 13.61 Wm−1K−1, respectively. Through depositing polydopamine (PDA) and grafting polyether amine (PEA) onto the surface of fibers, the poor fiber/epoxy interface was improved, resulting in 40.7% and 52.3% improvement in interlaminar shear strength (ILSS) and shear modulus, respectively. Simultaneously, a higher in-plane TC as high as 15.76 Wm−1K−1 is achieved. The heat dissipation evaluation indicates that the composite can reduce the temperature of the resistance wire by 14 °C. This work reveals the great potential of UHMWPE fibers in heat dissipation and provides a strong candidate for electrical insulating support materials with high TC for heat management of electronics.
Published Version
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