Abstract
Visible light emission observed in biased comb-type capacitors with a copper (Cu) damascene structure appears to be caused by electroluminescence. Photon emission probably occurs via energy states related to dangling bonds formed at a chemical-mechanical polished (CMP) surface. These energy states also appear to degrade the time-dependent dielectric breakdown (TDDB) characteristics and to increase line-to-line leakage currents. Ammonia (NH3) plasma treatment of a Cu-CMP surface dramatically improved TDDB and decreased the leakage currents. We attribute this to a reduced energy-state density through the termination of dangling bonds by hydrogen generated from the NH3 plasma.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
