Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systems

Reza N Esfahani,Matthew P Shuttleworth,Viktor Doychinov,Nathan J Wilkinson,Jack Hinton,Tom D.A Jones,Assel Ryspayeva,Ian D Robertson,Jose Marques-Hueso,Marc P.Y Desmulliez,Russell A Harris,Robert W Kay

doi:10.1016/j.addma.2020.101367

Reza N Esfahani, Matthew P Shuttleworth + Show 10 more

Open Access

PDF Available

https://doi.org/10.1016/j.addma.2020.101367

Copy DOI

Export

Save

Cite

Abstract
Highlights/Summary
Full-Text PDF
Similar Papers

Abstract

Listen

Additive Manufacturing is capable of producing highly complex and personalised products. However, innovation in both material science and processing is required to achieve the performance, reliability and miniaturization of modern mass-produced electronic systems. This article presents a new digital fabrication strategy that combines 3D printing of high-performance polymers (polyetherimide) with light-based selective metallisation of copper traces through chemical modification of the polymer surface, and computer-controlled assembly of functional devices and structures. Using this approach, precise and robust conductive circuitry is fabricated across flexible and conformal surfaces omitting the need to connect and assemble separate circuits. To show how this process is compatible with existing electronic packaging techniques a range of modern components are solder surface mount assembled to selectively metalized bond pads. To highlight the potential applications stemming from this new capability, high frequency wireless communications, inductive powering and positional sensing demonstrators are manufactured and characterised. Furthermore, the incorporation of actuation is achieved through selective heating of shape memory alloys with a view towards routes towards folding and deployable 3D electronic systems. The results in this paper show how this process provides the required mechanical, electrical, thermal and electromagnetic properties for future real-world applications in the field of robotics, medicine, and wearable technologies.

Highlights

Electronics manufacturing research using 3D digitally driven fabrication techniques such as Additive Manufacturing offers a route to creating highly customized devices [1,2,3]
This paper has presented a new technique for the production of rigid and flexible 3D electronic circuitry that exhibit excellent thermal, mechanical, and electromagnetic characteristics
This work demonstrates how closer integration of mechanical and electronic systems can be achieved through embedded actuation, sensing, power transfer, data processing and communications

Summary

Introduction

Electronics manufacturing research using 3D digitally driven fabrication techniques such as Additive Manufacturing offers a route to creating highly customized devices [1,2,3]. Advancements in generating conductor layers with a finer resolution, improved electrical properties and stronger adhesion are required Another critical limitation for the fabrication of electronic systems using 3D printing approaches is the methods for attaching componentry to the circuitry. Due to the low heat deflection of the insulator material, or the poor solderability of the conductor material, existing techniques have relied on bonding using conductive adhesives [7,8,9,12] or other low temperature joining materials [6,17,18] These materials do not require high temperature thermal processing but typically do not form the same metallurgical contact as solder, which partially diffuses into the metal bond pad to form a reliable low resistance attachment between the electronic components [20]. This paper presents a new hybrid additive manufacturing strategy that overcomes all the aforementioned challenges providing a route to fabricate personalised high-performance 3D electronic systems

Methods

Results

Conclusion