Abstract
A repeatable process, based on a photoresist lift-off technique, has been developed to fabricate chains of about 2.6 micron wide thin film metal lines with 5.6 micronc entre-to-centre spacing. The photoresist stencil is formed with a single level resist, the surface of which is altered by a chemical treatment. In this report, we present the details of the process that appears adequate for the study of material structures and experimental devices with fine-line geometry and is potentially suitable for the fabrication of miniaturized devices, such as, high frequency SAW oscillators and LSI/VLSI circuits.
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