Abstract
In order to solve the problem of cooling LED multi-chip LED module,an integrated heat pipe heat sink was designed and fabricated. Heat dissipation experiments were conducted to study effects on heat load,filling ratio and inclination angle on the thermal performance of the heat sink in nature convection. The results show that the efficient heat transfer of the heat pipe can reduce the thermal resistance of the heat sink effectively and the optimum filling ratio is 30% in this research.Inclination angle in the range of 0°- 50° has little effect on heat transfer capability of heat pipe at lower heat load. When the angle reaches 75°,heat transfer of heat pipe and thermal resistance of heat sink are all subject to a significant deterioration. The time heat sink enters stable state is about30 min and is not affected by the magnitude of the power. However,the heat sink works stably after40 min when angle is 75°. Compared to traditional parallel plate fins and sunflower fins heat sink,the chip junction temperature with integrated heat pipe heat sink is smallest.
Published Version
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