Abstract
An LED array module was developed by using the microbump bonding method by which the electrodes of LSI chips and circuit substrate are press-bonded by utilizing the shrinkage stress produced in a light setting insulating resin. The LED array module has a resolution of 400 DPI, and is constructed by face-down mounting of 54 each of the LED chips and driver LSIs on a glass substrate. These LED chips, having an electrode pitch of 63.5 mu m, are disposed on the glass substrate at a pitch of 10 mu m. A dedicated bonder was developed for this assembling work. A report on the LED array module assembling process and the construction of a bonder is presented. >
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