Abstract
High lead solders have long been used for the assembly of underhood automotive thick-film hybrid modules. With the move to lead-free solders in the electronics industry, there is an increasing interest in alternatives to high lead solders in these applications. A AgBiX solder paste has been evaluated for SiC die and resistor attach for 200 °C applications in vehicles. Die attached to thick-film Ag metallized substrates showed no degradation in shear strength after 2000-h aging at 20 °C, while die attached to PdAg thick-film metallization exhibited a decrease in shear strength of $\sim 30$ %. After 2000-h aging at 200 °C, chip resistors showed a decrease in shear force at fracture of $\sim 44$ % and 60% for assembly on thick-film Ag and thick-film PdAg, respectively.
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