Abstract
Conventional SAC lead-free solders have a melting point of 217°C to 227°C, limiting their suitability for applications at 200°C. AgBiXTM solder has potential for 200°C applications because of its ~260°C solidus temperature. BiAgX paste has been used to assemble SiC test die to ceramic substrates with direct bond copper (DBC), reactive brazed CuMo, thick film Au, thick film PtAu, thick film PdAg and thick film Ag. Surface mount chip resistors have also been attached to thick film metallized substrates. The assembly process and initial shear strength test results are presented. Assemblies have also been subjected to thermal testing: thermal cycling (−55°C to +195°C) and high temperature (200°C) storage. The shear strength of these assemblies after thermal testing are presented and compared to initial results.
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