Abstract
AgBiX™ (Indium Corporation) solder paste has a solidus temperature of ∼262°C after reflow, which is suitable for passive component, semiconductor and power die attach for 200°C applications. In this work, the paste has been used to assemble SiC die with Ti/Ni/Ag thin film metallization to Ag and PdAg thick film substrates. High temperature storage testing (200°C) was preformed to characterize the reliability of the assemblies. Surface mount chip resistors attached to thick film substrates were also subject to high temperature storage. Comparisons of the performance of die attach and resistor attach on Ag substrates and PdAg substrates are made. EDX and failure analysis was used to understand the role of Pd on the failure mode and lower aged shear strengths with the thick film PdAg conductors.
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