Abstract
The influence of Pb contamination on the solidification behavior of a transient liquid-phase powder-processed Sn-Bi solder paste has been studied using differential scanning calorimetry. The development of low-temperature ternary reactions was found to be very sensitive to both the Pb and Bi content of the solder. Solders with high Bi content favored the formation of the ternary eutectic reaction. Solders with high Pb contents favored the formation of a ternary peritectic reaction. These results agree very well with solidification predictions present in the literature for ternary Sn-Bi-Pb alloys. In particular, the dependence of ternary reactions on composition is due to a change in solidification path. Alloy compositions which mark the transition from one path to the next were identified.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
