Abstract
Aluminum-induced crystallization of a-SiO1.8 in the layer exchange mode was carried out. Annealing of a “SiO2 substrate/Al/a-SiO2 membrane/a-SiO1.8” stacked structure at 550 °C led to the formation of a continuous polycrystalline Si (poly-Si) thin film on the substrate, which is characteristic of the layer exchange process. However, the upper layer formed in the process had structural features that were not previously observed for the pure and slightly oxidized amorphous silicon as a Si-containing thin-film precursor. The high oxygen content in the system led to the non-uniform transformation of a-SiO1.8 layer, namely, to the formation of Al oxide islands of submicron size nearby the interface with poly-Si thin film as a result of the complete oxidation of the Al layer, whereas the other part of the upper layer was still unchanged. In addition, the embedding of Al into the SiO2 substrate accompanied by its oxidation was observed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
