Abstract
White beam Laue transmission diffraction topography has been used to determine the curvature of a crystalline substrate, from which the stress in the overlaying coating is determined. A detailed analytical method has been developed which correlates the introduction of curvature to the substrate in two orthogonal directions with attendant changes in the dimensions of a given topographic reflection. The size of a given reflection is found to depend on the dimensions of the incident beam, the horizontal and vertical incident beam divergences, the orthogonal curvatures of the crystalline substrate, the camera length, and the indices of the selected reflection. The thermal tests of sputtered polycrystalline Ta and Cr films on Si (100) substrates are used to demonstrate the applicability of this phenomenon. Simultaneous observation of film delamination and quantification of associated stresses is shown to be possible.
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