Abstract

The mathematical modeling of MHD free convection thermal flow in a tilted V-shaped electronic assembly, packed with Cu-water nanofluid is numerically performed. The physical domain considered in this study is designed by two V-shaped active walls connected by two closed insulated walls. The cold partition is kept at temperature Tc while the hot one consists of seven bands, alternately maintained at temperature Th and insulated from the environment. The lattice Boltzmann method with the D2Q9 lattice form is employed to solve the governing equations. This review covers a wide range of module inclination angle (0°⩽γ⩽225°), module aspect ratio (0.2⩽AR⩽0.8), Hartmann number (0⩽Ha⩽80), concentration of nanoparticles (0%⩽ϕ⩽6%) and Rayleigh number (104⩽Ra≤106). The results demonstrated that the average Nusselt number rises with an increase in the nanoparticles concentration and the Rayleigh number, but it reduces with increasing the module aspect ratio and the Hartmann number. Moreover, the heat flow rate is remarkably influenced by the module inclination angle at γ=45°. Further, the correlations of average Nusselt number with pertinent parameters are proposed which optimizing the reliability of the system performance.

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