Abstract
Currently, pulsed laser deposition (PLD) is a widely used technique to grow thin films for academic research and for industrial applications. The PLD has superior advantages including versatility, control over the growth rate, stoichiometric transfer and unlimited degree of freedom in the ablation geometry compared to other deposition techniques. The primary objective of this review is to revisit the basic operation mechanisms of the PLD and discuss recent modifications of the technique aimed at enhancing the quality of thin films. We also discussed recent progress made in the deposition parameters varied during preparation of luminescent inorganic oxide thin films grown using the PLD technique, which include, among others, the substrate temperature. The advanced technological applications and different methods for film characterization are also discussed. In particular, we pay attention to luminescence properties, thickness of the films and how different deposition parameters affect these properties. The advantages and shortcomings of the technique are outlined.
Highlights
Different physical vapor deposition (PVD) techniques used for coating or thin film growth on solid substrates, such as molecular beam epitaxy (MBE), electron beam physical vapor deposition (EBPVD), pulsed laser deposition (PLD), arc discharge, reactive sputtering and ion beam sputtering, have been used extensively in laboratory research and industrial applications
Luminescence materials otherwise known as phosphors have found applications in electronic information display, advertising, solid-state lighting, solar cells, theft prevention, medicine, data storage, quality control, optical amplifiers, optical laser, scintillation and temperature measurement in both industrial and biological systems
Phosphors comes in a powder form, most of their applications is based on thin film forms
Summary
Different physical vapor deposition (PVD) techniques used for coating or thin film growth on solid substrates, such as molecular beam epitaxy (MBE), electron beam physical vapor deposition (EBPVD), pulsed laser deposition (PLD), arc discharge, reactive sputtering and ion beam sputtering, have been used extensively in laboratory research and industrial applications. Among these techniques, PLD have some distinguished capabilities such as the ability to transfer stoichiometry of the material from target to the substrate, high deposition rate, flexibility in wavelength and power density and the ability to deposit multiple layers. Contrary to the simplicity of the system set-up, the principle of PLD involves four complex physical phenomena, which include laser beam-target interaction, ablation dynamics and plume formation, ablated materials evaporation onto the substrate and nucleation and growth of thin films
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
