Abstract
Laser-based electro-optic probing is a proven noninvasive technique for testing high-speed microwave circuits on substrates such as gallium arsenide (GaAs) and indium phosphide (InP). We have extended this technique to probe circuit structures on doped and poled polyimide substrates that are useful in high-density packaging applications such as multichip modules (MCMs). Our results demonstrate the potential to improve the testability of MCMs by probing circuit structures that are buried in the central layers of an MCM. In addition to direct, point-by-point electric field measurements in representative MCM structures, we have investigated the poled polyimide dielectric efficacy both as a dielectric circuit layer and as a suitable electro-optic material.
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