Abstract
In this letter we report on a novel technique for metallizing contact holes and via plugs which is based on laser-surface-seeded selective chemical vapor deposition (LSS/CVD) of aluminum from dimethylaluminum-hydride (DMAlH). In this metallization process, a laser is used to photolytically deposit a thin layer of metal, which provides a seed layer for subsequent selective CVD. In this work we apply the LSS/CVD technique to via hole filling, and demonstrate that small-diameter (0.7 μm), high-aspect-ratio (3:1) aluminum plugs can be formed without the incorporation of voids. The morphology of the plug metal is very good, and the resistivity of aluminum deposited with this technique can be as low as twice that of the bulk metal.
Published Version
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