Abstract
The work addresses the issues of laser plasma etching of electronic materials on the example of the separation of diamond and sapphire plates into crystals. The developed method is based on a physical phenomenon – an optical breakdown in specially selected gas environments in which plasma is set on fire and plasma etching of sub-base materials (plates) with the for-mation of volatile products of chemical reactions and their evacuation by vacuum system. The work was carried out in the range of working pressures of 110-3–110-1 Torr. Fluoride sys-tems were used as work environments: (SF6/O2; CClF3/O2; F2, etc.) and pure oxygen (O2). Both the system – fluoride and oxygen "work" well. The oxygen system is preferable for eco-nomic and environmental reasons.
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