Abstract
Laser Induced Plasma Assisted Ablation (LIPAA) has been used to carry out back side dry etching/ablation of different optical glasses under vacuum. It is observed that etching depth increases with decrease in target-substrate gap and becomes maximum (50 μm) at zero gap size for steel-quartz pair. The maximum ablation depth for brass-quartz pair was 25 μm. The effects of laser power on etching depth and laser scan speed has also been reported.
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