Abstract
Seeking better efficiency and faster turn-around in microelectronics manufacturing, a maskless laser direct-write process has been developed and applied to fabricate practical devices. The process uses a short pulse UV laser to transfer material from a source layer, or “ribbon”, to a substrate. Patterning is achieved by scanning the laser beam, translating the receiving substrate, or both. No wet chemistry is required. This technique has a minimum resolution of 10 μm. Using low temperature Co-fired ceramic materials and the laser direct-write process, a multi-layer laminated band pass filter was fabricated. The inductors, resistors, and capacitors were fabricated on separate layers. The connections between the layers were made through interlayer vias. Test results show fully functional band pass filters with center frequency around 1.15 GHz. Simulation results are also discussed.
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