Abstract

Laser cutting and micromachining can be applied to solar cell materials for processing and characterization applications. An ultrashort pulse (USP) laser with sub-picosecond pulse width can remove material with minimal thermal effects or damage, which is termed ‘cold ablation’. Such USP laser cutting and scribing can be implemented for isolating areas within a larger cell while maintaining electrical performance and preventing laser-induced damage and shunting. Laser micromachining has been used to isolate a shunt to improve cell performance and to isolate a small, selected area to define a sample suitable for deep level transient spectroscopy.

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