Abstract
This paper presents a semiconductor laser beam shaping system that can collimate the irradiance profile effectively by using an ellipsoidal lens. Geometrical optics analysis based on the ray tracing method is done and the formulas to calculate the shape of ellipsoidal lens are given. Both the theoretical and experimental result show that the laser beam system works effectively; the divergence angle is reduced to less than 1° in the fast-axial direction. By using epoxy resin, this shaper collimates a semiconductor laser beam and packages the laser diode (LD) at the same time, which simplifies the manufacturing process and greatly reduces the LD volume. Because of the small volume, low-cost, high rigidity and easy fabrication, the shaper is of great value in the field of semiconductor laser diode applications.
Published Version
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