Large-Periphery ALGaN/GaN High Electron Mobility Transistors for High-Power Operation

Abstract

We report on AlGaN/GaN high electron mobility transistors (HEMTs) for high-power operation achieved by selective-area growth (SAG) technique based on plasma-assisted molecular beam epitaxy (PAMBE). Significant improvements in current density and on-state resistance were observed when SAG was employed. Maximum current of 1.75A and on-state resistance of 4.76mΩ cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> were demonstrated for a large-periphery HEMT with total gate width of 5.2mm. Low Schottky gate leakage current was also realized by the suppression effect of SAG and the use of Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> /SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> gate insulators, leading to a high gate breakdown voltage of over 200V at a short gate-to- drain distance of 6μm.