Abstract
In this study, SiO2 nanoparticles were in situ grown onto the surfaces of polyimide fibers via sol–gel synthesis and the corresponding paper-based composites were fabricated by wet-forming process using the as-obtained fibers as the starting materials. A simultaneous enhancement of the tensile and tearing index as well as the interlayer bonding strength of paper-based composites could be achieved with an increment of 17.7%, 17.2% and 50%, respectively. What is more, the dielectric strength of the resultant composites increased by 127% compared with the pristine paper-based composites. The results indicated that the SiO2 nanoparticles could be used as an excellent interfacial linker between the fibers and polymer matrix, and a smart cushion to release interior and exterior applied forces. Besides, satisfactory results on thermal stability of paper-based composites were attained after coated with SiO2 nanoparticles.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call