Abstract
The effects of thermal expansion incompatibility between silicon slices and various metal substrates are described for adhesive and solder joints. Dependable solder and adhesive joints have been achieved in mounting two-inch silicon slices. The size of the sillcon slices that can be solder or adhesive mounted to various substrates and withstand a specified temperature change was experimentally determined. Extrapolation of the present results can predict the suitability of substrate material for mounting larger than 2-in silicon slices. A one-dimensional theoretical model was found to describe the trends of the experimental data.
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