Large‐area, high‐temperature stainless steel foil substrate for manufacturing low‐cost and flexible CMOS polysilicon TFTs

Abstract

AbstractA large‐area stainless steel foil substrate which is compatible with high‐temperature (>800°C) processing was developed to support a hybrid printed and conventional process technology to fabricate polysilicon thin‐film transistors (TFTs). The purpose was to build a platform that could lead to low‐cost, roll‐to‐roll manufacturing of polysilicon TFTs. To fabricate a self‐aligned top‐gate TFT structure, a screen‐printed dopant process, which requires high‐temperature activation, was developed to substitute capital‐intensive ion implantation. For the pilot line process, a 300‐mm2 and 100‐μm‐thick stainless steel substrate made of an alloy with a low thermal expansion coefficient (CTE) was chosen. Then, the foil finishing process was optimized to achieve flatness and minimize surface roughness. A barrier and dielectric encapsulation were developed to prevent trace metal diffusion from the substrate into the active layers. The polysilicon TFTs were then evaluated with static and dynamic bending tests.