Abstract
AbstractHybrid organic‐inorganic polymeric films are widely used in various areas, for encapsulation, dielectrics, super‐hydrophobic surfaces, membranes, and other applications, because of the features of their organic and inorganic components. The initiated chemical vapor deposition (iCVD) process is developed to synthesize hybrid polymeric films via this approach. However, the conventional iCVD process is based on laminar injection, and has difficulty depositing hybrid films with uniform thickness and composition over the large areas required by industry. In this work, the geometry of the iCVD chamber is newly designed to enable conformal and uniform deposition over an 8‐inch area, using a dual showerhead structure injection system. The inorganic concentration and deposition rate can be linearly controlled by adjusting the flow ratio of the inorganic precursor and organic monomer, up to 25% and 2.75 nm min−1, respectively. In addition, the dual showerhead injector reduces the source consumption by 37%, compared to a conventional laminar flow iCVD chamber, while depositing a film with the same thickness and composition. The surface roughness of the entire 8‐inch area is less than 0.6 nm, showing that very uniform and homogeneous hybrid polymeric films can be successfully synthesized over a large area. In addition, the variation in electrical capacitance between metal–insulator–metal (MIM) structure devices is measured, and is within 4.1% over the entire wafer for films deposited with the dual showerhead chamber, compared with 30% for the conventional iCVD chamber. The iCVD process with the dual showerhead structure enables the synthesis of conformal and uniform hybrid polymeric films over a large‐scale area with lower source consumption, compared to conventional iCVD.
Published Version
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