Abstract
We have been studied fabrication mechanisms of functional thin films by a sputtering deposition method using metal based powder targets. Electron density and emission intensity in the processing plasma using powder target were higher than that using bulk target. They were slightly increased with increasing the powder size. On the other hand, electron temperatures of the plasma using powder target were almost same compared with that using bulk target. These results suggest that net-cathode surface area of the powder target is larger than that of bulk target, because roughness of the target surface was larger than that of bulk target. Therefore, secondary electron density and Ti atoms density from cathode surface were higher than that of bulk target.
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