Abstract
Abstract KME Cu-DLP is a phosphorus-deoxidized copper that contains a minimum of 99.90% copper and a small amount of residual phosphorus. Owing to the presence of residual phosphorus the electrical conductivity of KME Cu-DLP is lower than that of the high-conductivity and oxygen-free coppers (Cu-ETP, Cu-FRHC, and Cu-OF). This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming and heat treating. Filing Code: Cu-917. Producer or source: KME Germany GmbH.
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