Kinetics of Cationic Photopolymerizations of UV‐Curable Epoxy‐Based SU8‐Negative Photoresists With and Without Silica Nanoparticles

Abstract

AbstractSummary: This paper reports on the photocuring kinetics of protonic‐acid‐initiated cationic polymerizations of UV‐curable epoxy‐based SU8‐negative photoresist systems with and without silica nanoparticles, as assessed using photo‐DSC, FTIR spectroscopy, UV‐vis spectroscopy, and SEM. Photo‐DSC analysis using an autocatalytic kinetic model demonstrated that the cross‐link density and cure rate increased as the concentration of silica nanoparticles with surface silanol groups increased to 2.5 wt.‐%. This result was confirmed by FTIR spectroscopy, and suggests that the presence of silica nanoparticles of up to 2.5 wt.‐% promoted the cure conversion and cure rate of the UV‐curable hybrid organic/inorganic negative photoresists due to the synergistic effect of silica nanoparticles acting both as an effective flow or diffusion‐aid agent and as a proton‐donor cocatalyst during the cationic photopolymerization process. The decrease in the cross‐link density that occurred when the silica content was higher than 2.5 wt.‐% was attributed to aggregation between silica nanoparticles due to their high surface energy.SEM photograph at the film‐air interface of the UV‐cured hybrid organic/inorganic photoresist containing 10 wt.‐% silica nanoparticles.magnified imageSEM photograph at the film‐air interface of the UV‐cured hybrid organic/inorganic photoresist containing 10 wt.‐% silica nanoparticles.