(Keynote) Interconnect Innovations in Next Generation of Heterogenous Packaging Technologies

Abstract

Heterogenous device integration has become a critical capability need for the next generation of AI, Data Center, Graphics and FPGA devices. Advanced packaging technologies such as EMIB, Foveros & Co-EMIB are now enabling a dramatic increase in interconnect density and bandwidth, enabling integration of multiple types of heterogenous die (Logic, memory, transceiver and multiple nodes) onto a single package. In this talk, we will provide an overview of die-die and on package interconnect capabilities of these advanced packaging technologies. We will review innovations in metallization technologies that are enabling significant advances in on-package and within package interconnects. Finally, we will discuss technical advancements needed to drive the packaging technology roadmap forward.