Abstract

This paper proposes a kerfless wafer structure with built-in p-n junctions in n-type silicon wafers grown using Crystal Solar's high throughput epitaxy technology. Compared with a conventional p-type emitter by boron diffusion, ion implantation, or epitaxy, the built-in p-type emitter has a reduced and uniform doping concentration and increased thickness. The epitaxially grown wafers and conventional Czochralski (CZ) n-type wafers were processed into solar cells. A best efficiency of 22.5% with epitaxially grown wafers was achieved, with a 6 mV gain in open-circuit voltage, suggesting a high wafer quality and superiority of the deep epitaxial emitter over a standard boron-diffused emitter. Substrate reuse associated with the kerfless epitaxy technology is studied as well, with respect to its impact on solar cell efficiency. The data suggest no degradation in cell efficiency due to substrate reuse.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call