Abstract
Flow soldering process with a simple model has been studied using CFD. A printed circuit board with through-hole components and with surface-mounted components covered with a mask is the object of this study. In this process, surface mounted components are first soldered and covered with the mask; then through-hole components without the mask are soldered by dipping the board into a solder bath. We investigate the solder flow in a narrow opening between the masks. Surface tension and contact angles are decided by comparison with experiments.
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