Abstract
The microstructures of two commercial high strength, high conductivity copper alloys have been examined by transmission electron microscopy (TEM) following heavy ion irradiation. Both alloys were found to be resistant to microstructural changes over the temperature range of 100–250°C and peak damage levels of 40 dpa. There is no observable void formation in either of the as-received alloys following single ion irradiation to 40 dpa over a wide temperature range (100–550°C).
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