Abstract
In ULSI processes, metallic contamination controls are very important issues. For the ion implantation process it is known that several sources of contaminations still need to be controlled: metals from sputtering of the apertures or wafer holders, Na+ contaminations from filament impurities and messy maintenance procedure. ToF-SIMS is one of the most promising candidates to perform in-line surface analysis due to its high sensitivity. It is very common to use surface photo-voltage (SPV) techniques to control ion implanter equipments but this kind of analysis is an indirect measure for metallic contamination.The aim of this work is to study the possibility to use ToF-SIMS instead of SPV for in line equipment contamination monitoring. For this reason a comparison between SPV and ToF-SIMS data occurred. Good correlation between the data is shown; moreover ToF-SIMS spectra give detailed information about the other contaminations present on the wafer surface.
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