Ion implantation damage model for B, BF2, As, P, and Si in silicon

Abstract

In this article we describe a newly proposed and consistent damage model in Monte Carlo simulation for the accurate prediction of a three-dimensional as-implanted impurity profile and point defect profile induced by ion implantation in (100) crystal silicon. An empirical electronic energy loss model for B, BF2, As, P, and Si self-implants over a wide energy range has been proposed for silicon-based semiconductor device technology and development. Our model shows very good agreement with secondary ion mass spectrometry data over a wide energy range. For damage accumulation, we have considered the self-annealing effects by introducing our proposed nonlinear recombination probability function of each point defect for computational efficiency. For the damage profiles, we compared the published Rutherford backscattering spectrometry (RBS)/channeling data with our results of phosphorus implants. Our damage model shows very reasonable agreements with the RBS/channeling experiments for phosphorus implants.