Abstract
Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
